Low gas emission vacuum structural material '0.2% BeCu'
Creating Ultra Clean! Bringing innovation to manufacturing and analysis processes.
"0.2% BeCu" is a vacuum structural material with good thermal conductivity, low thermal emissivity, and suppresses outgassing. It is suitable for applications such as vacuum chambers requiring ultra-high vacuum environments, materials for analysis rooms in high-precision analytical devices, materials for ion sources in mass spectrometers, areas of devices that dislike outgassing near heat sources, sections requiring low temperatures, areas needing simplification and miniaturization of cooling equipment, and devices that require reduced time to reach vacuum and high throughput. 【Features】 ■ Good thermal conductivity and low thermal emissivity ■ Suppresses outgassing to the extreme ■ Achieves ultra-high vacuum pressures ■ Reduces evacuation time ■ Simplifies cooling equipment ■ Capable of 300°C baking ■ Compatible with copper gaskets *For more details, please download the PDF or feel free to contact us.
- Company：東京電子
- Price：Other
